Feature
- SECS ∕ GEM
- Process wafer expansion automatically
- CCD detects the outer diameter of wafer after expanding
Patent
CCD detects wafer after expandingFilm support mechanism
Advantages
- Minimize tape consumption
- Cassette/ Frame barcode reader and tape RFID reader
- Provide PAUSE function in automatic mode to supply frames and tapes.
Operation
Step 1
- Manually put the cassette with 8-inch frames attached wafers into the loading cassette, and an empty 6-inch cassette into the unloading cassette.
Step 2
- The 8-inch frame in the loading cassette is picked out by Arm. After reading Barcode, transferred to tuning module. The tuning CCD rotates the 8-inch frame and finds the flat and central position of wafer, and adjust X、Y、θ alignment. After tuning, the 8-inch frame is moved to expansion module by Arm.
Step 3
- The expansion module is closed, and the 8-inch frame is stretched and expanded downwards. After expansion, CCD inspection checks the external diameter, and re-expand if does not separate enough. The cutting mechanism in the expansion module is lifted up to cut off the original film and then lifted down to reset. After the 6-ich frame is mounted, Arm rotates the 6-inch frame, and Arm takes the 6-ich frame to expansion module.
Step 4
- The 6-inch and 8-inch frames are compressed by the pressing module. The pressing module is reset, and the 6-inch frame and the original film are turned over and transferred to the film detapping module by Arm. The original 8-inch frame is returned to pre-angle from 45° and transferred from the expansion module to the original frame collection by Arm. The original film on the 6-inch frame is detapped and transferred to the waste film tank by the detapping module.
Step 5
- The detapping module rotates and the 6-inch frame is returned to pre-angle. The 6-inch frame is taken to the unloading cassette by Arm.
Specifications
| Dimensions | 420 cm × 201 cm × 267 cm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 4000 kg |
| AC power | 1 Ø 240 Volt.(V) 50/60 Hz |
| Air supply | Air Pressure 6~8 Kgf/cm2 Air consumption 70 m3/h Air Tube Diameter Ø 12 mm |
Object Wafer and Ring
| Wafer size | 6″ |
|---|---|
| Chip size | 0.1×0.1 mm2 2×2 mm2 |
| Laser cut depth | None |
| Frame size | 6″ or 8″ |
| Tape size | 240 mm × 100 M (length) for 6-inch frame 300 mm × 100 M (length) for 8-inch frame |
Features
Automatic
Fully automatic rapid production
RFID Reader
Cassette/ Frame barcode reader and tape RFID reader
Minimize Tape Consumption
Minimize (6-inch frame) 265 mm (W) ×230±5 mm (L) tape consumption to reduce operation cost.
Adjustable Tape Tension
Provide optimum cutting conditions with adjustable tape tension.
Replace Film Scrolls Rapidly
Support to replace film scrolls and waste film scrolls rapidly.
Heat Expansion Station
Support to heat the wafer expansion station to 80℃.
CCD Inspection
CCD inspection checks the external diameter, and re-expand if does not separate enough.
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
