232FA Full Auto Wafer Washer
Feature
  • SECS ∕ GEM
  • Automated ultrasound cleansing
  • Barcode reader
Advantages
  • One-time 2 sets of Cassette
  • Heating function
  • 4 way flow and filtering function
Operation
  • Tank 1 Chemical Ultrasonic
  • Tank 2 Chemical Ultrasonic
  • Tank 3 DIW Ultrasonic
  • Tank 4 DIW Ultrasonic
  • Tank 5 DIW Ultrasonic
  • Tank 6 Vacuum Drying
Specifications
Dimensions 4330 mm × 2120 mm × 2980 mm ( W×D×H )
Weight 3500 kg
AC power 415V (50/60 Hz) 3 phase 5 wire Volt.(V)
240V (50/60 Hz) (RSTNG) Volt.(V)
Air supply Compressed Dry Air (CDA) 6~8 Kgf/cm2
N2 General Nitrogen 2 m³/min
Object Wafer and Ring
Wafer size 6″
Chip size
Laser cut depth
Frame size
Tape size
Features
Automatic

Fully automatic rapid wash

Barcode reader

Loading station is equipped with quantity inspection and wafer cassette ID reading functions

Cassette

One-time 2 sets of Cassette

Ultrasound cleansing

Smart automatic frequency tracing machinery

Heating

Heating function, 80℃ heat limit

Sensor

Equipped with Level Sensor to detect liquid level for ultrasound and pump detection, and without leakage examination.

Up down flapping

Up down flapping function that allows rapid adjustment

Wafer slant

Wafer slant adjustment which allows angle adjustment

Flow and filtering

4 way flow and filtering function

Water resistance monitoring

Water resistance level monitoring

*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.

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232FA

Full Auto Wafer Washer