Feature
- SECS ∕ GEM
- Suitable for silicon and Sapphire wafers
- Fully-automatic, high UPH
Advantages
- It adopts the Robot arm to raise the performance.
- The product can also be switched to the manual mode. It supports to process a small amount of rings or broken wafer quickly.
- The product can be paused in the automatic mode to fill rings, wafers, and films.
- According to the requirements of process, the product can process a stack of rings.
Operation
After Robot Wafer arm takes a wafer to Wafer Alignment Mechanism，starts vacuum and sucks the wafer. The wafer alignment mechanism rotates the wafer to the specific flat position. The value is transferred to the motor of rotation table to modify the angle. Robot Wafer arm sucks the wafer to Platform of pressing mechanism.
Step 1
- Empty Ring Pick Arm moves to Empty Ring Lifting Mechanism to take a ring, and put it on Suction Platform. The Suction Platform moves to the mounting position. There are roller and knife attached on Dicing Mechanism, mounting and dicing can be processed at the same time.
Step 2
- Frame with film Pick Arm takes the frame with film to the platform of Pressing Mechanism. Top and bottom vacuum cover are combined to become a closed space. The film will be mounted on the wafer closely.
After mounting, the vacuum chamber breaks the vacuum. Positive and negative vacuum mounting mechanism is lifted.
Specifications
| Dimensions | 2320 mm × 2210 mm × 2620 mm ( Ｌ×Ｗ×Ｈ ) |
|---|---|
| Weight | 2100 kg |
| AC power | Working Voltage: 240 V 50 ∕ 60 Hz 1 Ø Volt. (V)
Power Switch ( NFB ): 60 A |
| Air supply | Air Pressure 5~8 Kgf ∕ cm2
Air Tube Diameter Ø 12 mm |
Object Wafer and Ring
| Wafer size | 4″、6″ or 8″ wafer |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Frame size | 8″ or 5.5″ |
| Tape size | for 8-inch frame can be 300 mm × 100 M
for 5-inch frame can be 230 mm × 100 M |
Features
Film Detections
Support the detections for film mounting and lack
Automatic
Fully automatic rapid production
Alignment
Alignment sensor for wafer alignment mechanism
Barcode Reader
Wafer ID reader and ring barcode reader
Quick Replacement
Quick replacement of membrane and waste material reels
Minimize Reduce
Reduce the operation cost by minimizing the tape consumption to about 275 mm
Tension-Adjustable
Tension-adjustable tape supports the optimum dicing conditions
Heating
Wafer suction platform can be heated to 50℃
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
