Feature
- 3 large hammers for multi-stage control
- Upside down X-axis CCD mechanism
Patent
Pressing MechanismLightingBreaking Mode
Advantages
- The range of hammer striking force adjustment is increased to correspond to different wafer materials or cutting depths for better production yield.
Operation
The wafer attached to Flat Ring is placed onto the table of the breaker from the cassette automatically. In the image system, the laser cutting line level is adjusted automatically, and the laser cutting traverse level is adjusted automatically. After the locations of Y-axis and cutter-axis are searched on the edge of the wafer, breaking (in X and Y directions) is performed according to the recipe of the work piece types. After breaking is complete, the operator unloads the work piece.
Specifications
| Dimensions | 1000 mm × 1000 mm × 1990 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 600 kg |
| AC power | 1 Ø 220 V ∕ 4.5 A |
| Air supply | 5 Kgf ∕ cm2 ( 6 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 2″ ~ 4″, under thickness 300 μm |
|---|---|
| Chip size | 100 μｍ × 120 μｍ |
| Flat ring size | 6″ Flat Ring ( inner Ø 194 mm; outer 228 mm; ｔ＝ 1.0 ~ 1.3 mm ) |
Features
CCD of Detecting Full ∕ Broken Wafer
Automatic identification of intact ∕ broken work piece and rapid search for wafer boundary for great reduction of splitting time
Y-Axis Aligns Automatically
Set each cut or any cut to align once
θ-Axis Calibration and Y-Axis Alignment
Set each cut or any cut to align once
Step Servo Motor for Key Mechanism
Double advantages of positioning compensation by servo motor and the stability of step motor
Patented Hold-Down Mechanism and Several Patented Breaking Modes
Wafers are held down to reduce wafer warping and improve production yield for breaking
Image Setting
Image identification is performed graphically; one image for each of sides A and B for image identification
Vision Recognized
Non-cut detecting function, multiple non-breaking check functions
Adjust Level
Starting at auto breaking mode and adjusting the level have been double checked to make sure the level is correct
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.。
