Feature
- Uni-body machine for extra rigidity
Patent
12 Patents in Taiwan and China
Advantages
- Advanced equipment
- Lower cost
- Better production yield
Operation
The operator places the wafer attached to a ceramic disc on the platform of grinder to start manually parameter setting and thickness reduction. The semi-auto mode (i.e. automatic compensation) can be activated to measure wafer thickness and compensate to the defined target value both automatically until the thickness is reduced to target value.
Specifications
| Dimensions | 1440 mm × 1865 mm × 2440 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 5050 kg |
| AC power | 3 Ø 220 V |
| Air supply | 5 Kgf ∕ cm2 ( 12 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 2″~ 4″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Flat ring size | None |
Features
Moveable Operation Screen
Uniform Wafer Thickness
Vertical Processing for Extra Rigidity
Colorful PC Touch Screen for Control Interface
Automatic Measurement of Wafer Thickness
The grinder and automatic measurement are combined in one unit for automatic measurement of wafer thickness
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
