Feature
- SECS ∕ GEM
- Suitable for single ∕ double-sided films
- Fully automatic mounting and laminating (suitable for mounting wafer + ceramic plate ∕ glass)
Advantages
- The laminating pressure is applied evenly.
- Quick replacement of membrane and waste material reels.
- Fully automatic rapid production with robot arm
- Lamination in a vacuum environment reduces significantly the residual gases at the laminating interface.
Operation
Step 1
- Place the 6” wafer cassette, wafer carrier cassette and membranes at the predefined locations to start.
Step 2
- Take the 6” wafers out of the cassette using the robotic arm. Align the wafer and identify the top and bottom surfaces before placing the wafers on the attachment platform.
Step 3
- Move the attachment platform to the membrane application position. With the pressing roller and membrane clamp pick up the membrane and move the moving carrier to the cutting position.
Step 4
- Lower the cutter to the predefined position. Rotate the cutter to cut the membrane. Raise the cutter after cutting the membrane.
Step 5
- Move the moving carrier to the peeling position. With the peeling tape, remove the release film from the 6” wafers. Move the moving carrier to the vacuum lamination position.
Step 6
- Take the wafer carriers out of the cassette with the robotic arm. Align the carriers and identify the top and bottom surface before placing the carriers on the attaching disc.
Step 7
- Lower the vacuum laminating mechanism to the predefined position and start vacuuming with the vacuuming cover. Start the lamination of the 6” wafers and the carriers as soon as the predetermined vacuum value is reached.
Step 8
- As the wafers and carriers are laminated, the robotic arm picks up the finished products and loads them in the cassette at the finished product area. The process is complete.
Specifications
| Dimensions | 2800 mm × 1200 mm × 2500 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 2000 kg |
| AC power | 3 Ø 220 V ∕ 50 A |
| Air supply | 5~8 Kgf/cm2 (12 ØTube) |
Object Wafer and Ring
| Wafer size | 6″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Wafer carrier | 8″ |
Features
Laminate Evenly
The laminating pressure is applied evenly
Quick Replacement
Quick replacement of membrane and waste material reels
Robot Arm
Fully automatic rapid production with robot arm
IR Lamp
Optional IR lamp for heating depending on process needs
Vacuum
Lamination in a vacuum environment reduces significantly the residual gases at the laminating interface
Cut to Fit Shape
For double-sided lamination, the film is cut to fit the required shape at the wafer laminating station according to the outer diameter of the wafer
Barcode Reader
For lamination, it can read barcode to record wafer information
Aligner Identify
The combination of robotic arm and aligner helps identify the front and rear sides of the wafer and laminating film and flip them over if necessary and the work piece rotates to the correct laminating position automatically
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
