Feature
- Suitable for square frame
- Suitable for 2” ∕ 4” ∕ 6” wafers
- Film cutting by melting, tensioned film
Advantages
- Easy film replacement
- High tension on the film mounting side
- No residual bubbles
- No damage to flat ring
- User-friendly operation interface
- Serves as manual film remover as well
- Repeated wafer rolling for increased adhesion
Operation
Place the square frame on the mounter carrier and then a 2”, 4” or 6” wafer on the wafer suction seat. Activate flat ring suction and wafer suction. The carrier moves to film attaching position. The film is lowered and cut by melting automatically onto the square frame. The carrier moves out in front of the placement area where a roller makes the film adhere to the wafer. The adhesion pressure is adjustable depending on the type and thickness of wafer. The film tension is adjustable to meet the client’s process need. The operator removes the work piece after adhesion.
Specifications
| Dimensions | 1000 mm × 1041 mm × 1880 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 500 kg |
| AC power | 1 Ø 220 V ∕ 10 A |
| Air supply | 6~8 Kgf ∕ cm2 (10 ØTube) |
Object Wafer and Ring
| Wafer size | 2″~ 6″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Flat ring size | Square frame ( Inside : ☐ 192 mm ; Outside : ☐ 211.5 mm ;ｔ＝ 1.35 mm ) |
機台特性
Square Frame Placement Detection
Patented Mechanism of Wafer Suction by Area
Wafer suction by area to reduce wafer warping and improve production yield of film attachment
Multiple Options for Wafer Suction
Independent Square Frame Film Attachment Possible
Quick Replacement
Quick replacement of membrane and waste material reels
Adjustable Adhesion Pressure Based on Thickness
Full ∕ Broken Wafer Mounted
Automatic 2”, 4” full ∕ broken wafer mounted
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
