Feature
- Suitable for tape process
- Innovated, environment-friendly, energy-saving and efficient
Patent
12 Patents in Taiwan and China
Advantages
- No need for solvent wash
- No need for wax on ∕ off process
- Lower cost and better production yield
Operation
The operator places the wafer attached to a flat ring + film on the platform of lapping to start manually parameter setting (e.g. work pressure, lapping time, and so on) and lapping until the time is up. The operator manually removes the wafer to finish the lapping.
Specifications
| Dimensions | 1350 mm × 2235 mm × 2555 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 3250 kg |
| AC power | 3 Ø 220 V |
| Air supply | 5 Kgf ∕ cm2 ( 12 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 2″~ 6″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Flat ring size | 10″ Flat Ring ( inner Ø 300 mm; outer 360 mm；ｔ＝1.0 ~ 1.3 mm ) |
Features
Cooling System
No Need for Wax On ∕ Off
Automatic Trimming with One Key Stroke
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
