Feature
- Panoramic Camera
Patent
Pressing MechanismLightingBreaking Mode
Advantages
- Search edge of wafer automatically
- Non-cut detecting function
- Advanced image processing system
Operation
The wafer attached to Flat Ring is placed onto the table of the breaker from the cassette by operator. In the image system, the laser cutting line level is adjusted automatically, and the laser cutting traverse level is adjusted automatically. After the locations of Y-axis and cutter-axis are searched on the edge of the wafer, breaking (in X and Y directions) is performed according to the recipe of the work piece types. After breaking is complete, the operator unloads the work piece.
Specifications
| Dimensions | 950 mm × 913 mm × 1800 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 500 kg |
| AC power | 1 Ø 220 V ∕ 4.5 A |
| Air supply | 5 Kgf ∕ cm2 ( 6 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 4″, under thickness 300 μm |
|---|---|
| Chip size | Over 175 μｍ |
| Flat ring size | 6″ Flat Ring ( inner Ø 194 mm; outer 228 mm; ｔ＝ 1.0 ~ 1.3 mm ) |
Features
Panoramic Camera
Effective improvement of identification
Y-Axis Aligns Automatically
Set each cut or any cut to align once
θ-Axis Calibration and Y-Axis Alignment
Set each cut or any cut to align once
Break Manually
Manual breaking and secondary breaking are provided
Patented Hold-Down Mechanism and Several Patented Breaking Modes
Wafers are held down to reduce wafer warping and improve production yield for breaking
Image Setting
One image for each of sides A and B for image identification
Vision Recognized
Non-cut detecting function, multiple non-breaking check functions
Search Edge of Wafer Automatically
Adjust Level
Starting at auto breaking mode and adjusting the level have been double checked to make sure the level is correct
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
