2282-3FA  Fully Automatic Wafer UV Irradiation System
Feature
  • The luminous exposure can automatically adjusted according to the light decay of a lamp, chambers filled with nitrogen, printed marks on curing workpieces
Advantages
  • Illumination monitoring
  • Nitrogen chamber setting
  • Dual transport arm operation
  • Loading and unloading in a AGV unmanned transport system
Operation

Fully Automatic

Specifications
Dimensions 2265 × 1435 × 2317 mm ( W×D×H )
Weight 1790 kg
AC power single-phase 220V 60HZ
Air supply 6kgf ∕ cm2
Object Wafer and Ring
Wafer size 8-inch、12-inch、square 212 × 216 mm
Ring size outer diameter Ø296, inside diameter 250, width 276,t=1.2 mm

outer diameter Ø400, inside diameter 350, width 380,t=1.5 mm

Label size
Features
Barcode reader

Cassette barcode reading, frame barcode reading.

Double Slot

The number of wafers in the cassette, position, stacked wafers, double-slot detection.

AGV

Loading and unloading in an unmanned transport system.

Temperature monitoring

Illuminance meter monitoring, temperature monitoring.

Signal Feedback

Digitization of each monitoring meter head and signal feedback.

Static Elimination

Static elimination device.

SEMI

SECS / GEM / E84

*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.

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