Feature
- Suitable for rubber products
Patent
Pressing MechanismLightingCutting Mode
Advantages
- Search edge of wafer automatically
- Non-cut detecting function
- Advanced image processing system
Operation
The wafer attached to Flat Ring is placed onto the table of the Cutting Machine from the cassette automatically. The image processing system automatically aligns the leveling, Y-axis and cutter axis on both sides of laser cutting line and searches for product boundary. The cutting is made base on the parameters specified for the work piece (in X- and Y-direction). Once split, the work piece is removed by the operator.
Specifications
| Dimensions | 950 mm × 913 mm × 1800 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 470 kg |
| AC power | 1 Ø 220 V ∕ 4.5 A |
| Air supply | 5 Kgf ∕ cm2 ( 6 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 4″ x 4″ MAX; Pitch 0.5~2.0 mm |
|---|---|
| Chip size | NONE |
| Laser cut depth | NONE |
| Flat ring size | 6″Flat Ring (inner Ø194 mm; outer Ø228 mm; ｔ＝ 1.0~1.3 mm) |
Features
Y-Axis Aligns Automatically
Set each cut or any cut to align once
θ-Axis Calibration and Y-Axis Alignment
Set each cut or any cut to align once
Break Manually
Manual cutting and secondary cutting are provided
Adjust Level
Starting at auto cutting mode and adjusting the level have been double checked to make sure the level is correct
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
