Feature
- SECS / GEM functions
- Breaks 12″ wafer attached to 12″ frame
- OCR Wafer ID identification
- Capable of working on wafers with metal balls on surface
- Breaks 8″/ 12″ wafers by switching with software, without the need to change conversion kit
- Image acquisition from front or back of the wafer can be set by recipe depending on product requirements
- Special cushioned platform structure to improve product breaking yields
- Advanced dust collection for instant dry cleaning
Patent
Various patented breaking patternsMultiple uninterrupted detection functions
Advantages
- Cassette barcode conversion to recipe function
- User-friendly design with adjustable interface for standing and sitting positions
- Breaking speed can change instantly during operation, greatly increasing yields
- Multi-stage pressure detection, fully automatic calculation of optimum breaking parameters to raise product yields
- Fully automatic CCD alignment double check and switchable with wafer recipe, automatic breaking
- CCD autofocus for warpage products
- Frame warp detection
Operation
Pull out drawer to place cassette → Use gripper to remove frame from cassette → Remove frame and back it into alignment position → After alignment, transfer arm, magnet and cylinder downwards to suck in the frame → Stop moving to confirm wafer barcode when the arm moves past OCR → On confirmation of completion, continue to move the arm to the breaking platform and transfer arm, magnet and cylinder upwards to release the magnet from the frame and place the frame back on the platform. → Move platform to breaking zone for breaking → Once breaking is complete, transfer the arm to retrieve the frame → Move to gripper platform for alignment → After alignment, use the jaws to pick up the frame and place it back into the cassette.
Specifications
| Dimensions | 1555 mm × 1800 mm × 1980 mm ( Ｌ×Ｗ×Ｈ ) |
|---|---|
| Weight | 1800 kg |
| AC Power Supply | 3 Ø ∕ 220 50 ∕ 60 HZ Volt. (V) |
| Air Source | 85-114 psi ∕ 2 ft3/min @ 12mm diameter |
Object Wafer and Ring
| Wafer size | 8″ 12″ |
|---|---|
| Chip size | 2 ~ 150 mm |
| Frame size | 12″ |
Features
Upper CCD
X-axis upper CCD auto-recognition of opaque (ODR) products
Lower CCD
X-axis lower CCD mechanism assists upper CCD in the tool setting axis
Cassette
Double cassette design
Wafer Barcode Reading
Cartridge Barcode Reading
Fully Automatic Rapid Production
Blade Cleaning and Vacuuming
A set of mobile rotating brushes on the side of the blade and a simultaneous vacuuming action prevent the blade from sticking to glass debris for long periods of time.
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
