Feature
- SECS ∕ GEM
- Process wafer lamination automatically
- Minimize tape consumption
Advantages
- UV-LED lamp set is used with no ozone pollution.
- Large number of Loading / Unloading cassette
- Dual screen for easy operation
- Important statistics can be graphically
Operation
Using Robotic Arm, the 6” wafer is taken out from the loading cassette, and after the center alignment and the front and back interpretation and judgment, it is placed on the wafer suction platform.
Step 1
- The wafer suction platform is moved to the tape laminating position, and the tape is attached to the wafer by a tape roller. The rotary cutter cuts the tape.
Step 2
- Arm takes the wafer from the transfer station to the UV-LED lamp mechanism for illumination. After the UV irradiation is completed, Arm will retrieve the finished product and place it into the wafer unloading cassette to complete the process.
Specifications
| Dimensions | 2150 mm × 1600 mm × 2530 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 2500 kg |
| AC power | Working Voltage: 415 ( 3 phase ) ∕ 240 ( 1 phase ) Volt. (V) Plant Safe Current: 60 A |
| Air supply | Air Pressure 0.8 MPa Air Tube Diameter Ø 12 mm |
Object Wafer and Ring
| Wafer size | 6″ |
|---|---|
| Chip size | – |
| Laser cut depth | – |
| Flat ring size | – |
| Tape size | Width 180~250 mm × Length 100 M |
Features
Automatic
Fully automatic rapid production
Adhesive
The adhesive membrane does the job for lamination.
Replace Tape Scrolls Rapidly
Support to replace tape scrolls and waste tape scrolls rapidly.
Barcode Reader
Process wafer lamination with barcode reader to facilitate production records.
Applied Evenly
The laminating pressure is applied evenly.
Cut to Fit Shape
Cut in line with the size of the outer diameter of the wafer.
Aligner Identify
The combination of robotic arm and aligner helps identify the front and rear sides of the wafer and laminating tape and flip them over if necessary and the work piece rotates to the correct laminating position automatically.
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
