2372-3FA Fully Automatic Wafer Mounter
Feature
  • Luminous exposure can be adjusted according to the change of recipes
  • Bernoulli fork, supporting wafers with the warpage of less than 7mm
  • Tape visual defect inspection, peeling off UV tape
  • Precut tape with low tension mounting mechanism
Advantages
  • Illumination monitoring
  • Temperature monitoring of the illumination room
  • Multi-screen touch interface
  • FFU HEPA high efficiency air filtration meeting the requirements for Class 1000 Cleanroom
  • Loading and unloading in a AGV unmanned transport system
  • Tape RFID identification system
  • Handheld barcode scanner setting
Operation

Fully Automatic

Specifications
Dimensions 3323 × 2930 × 2573 mm (W×D×H)
Weight 4600 kg
AC Power single-phase 220V 60HZ
Air Source 6kgf ∕ cm2
Object Wafer and Ring
Wafer size 8-inch、12-inch、square 212 × 216 mm
Ring Size outer diameter Ø296, inside diameter 250, width 276,t=1.2 mm
outer diameter Ø400, inside diameter 350, width 380,t=1.5 mm
Tape size 8-inch Precut = 290 mm, normal =300 mm
12-inch Precut = 390 mm, normal = 400 mm
Features
The precut tape mounting mechanism

Adopted to achieve low tension mounting.

Double-slot judgment

The number of wafers in the cassette, position, stacked wafers, double-slot detection.

AGV

Loading and unloading in an unmanned transport system.

Temperature monitoring

Illuminance meter monitoring, temperature monitoring.

Meter signal feedback

Digitization of monitoring meter, signal feedback.

Label Sticker

60 x 10 and 60 x 12 mm label

Supporting static elimination

Static Eliminator

SEMI

SECS-GEM communication with E84 interface

*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.

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