Feature
- Luminous exposure can be adjusted according to the change of recipes
- Bernoulli fork, supporting wafers with the warpage of less than 7mm
- Tape visual defect inspection, peeling off UV tape
- Precut tape with low tension mounting mechanism
Advantages
- Illumination monitoring
- Temperature monitoring of the illumination room
- Multi-screen touch interface
- FFU HEPA high efficiency air filtration meeting the requirements for Class 1000 Cleanroom
- Loading and unloading in a AGV unmanned transport system
- Tape RFID identification system
- Handheld barcode scanner setting
Operation
Fully Automatic
Specifications
Dimensions | 3323 × 2930 × 2573 mm (W×D×H) |
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Weight | 4600 kg |
AC Power | single-phase 220V 60HZ |
Air Source | 6kgf ∕ cm2 |
Object Wafer and Ring
Wafer size | 8-inch、12-inch、square 212 × 216 mm |
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Ring Size | outer diameter Ø296, inside diameter 250, width 276,t=1.2 mm outer diameter Ø400, inside diameter 350, width 380,t=1.5 mm |
Tape size | 8-inch Precut = 290 mm, normal =300 mm 12-inch Precut = 390 mm, normal = 400 mm |
Features
The precut tape mounting mechanism
Adopted to achieve low tension mounting.
Double-slot judgment
The number of wafers in the cassette, position, stacked wafers, double-slot detection.
AGV
Loading and unloading in an unmanned transport system.
Temperature monitoring
Illuminance meter monitoring, temperature monitoring.
Meter signal feedback
Digitization of monitoring meter, signal feedback.
Label Sticker
60 x 10 and 60 x 12 mm label
Supporting static elimination
Static Eliminator
SEMI
SECS-GEM communication with E84 interface
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.