Feature
- Suitable for tape process
- Innovated, environment-friendly, energy-saving and efficient
Patent
12 Patents in Taiwan and China
Advantages
- No need for solvent wash
- No need for wax on ∕ off process
- Lower cost and better production yield
Operation
The operator places the wafer attached to a flat ring + film on the platform of polisher to start manually parameter setting and polishing until the time is up. The operator manually removes the wafer to finish the polishing.
Specifications
| Dimensions | 1350 mm × 1550 mm × 2555 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 2800 kg |
| AC power | 3 Ø 220 V |
| Air supply | 5 Kgf ∕ cm2 ( 12 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 2″~ 6″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Flat ring size | 10″ Flat Ring ( inner Ø 300 mm; outer 360 mm; ｔ＝1.0 ~ 1.3 mm ) |
Features
Cooling System
Uniform Wafer Thickness
Automatic Slurry Recycling System
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
