Feature
- Suitable for octagonal rings
- Suitable for 2”~ 6” wafers
- Cutting with cutter
Advantages
- No residual bubble
- No damage to flat ring
- Easy film replacement
- User-friendly operation interface
- Serves as semiautomatic film remover
- Repeated wafer rolling for increased adhesion
Operation
Place a 10” flat ring on the carrier of the mounter, and then a wafer on the wafer suction seat. Activate flat ring suction and wafer suction. The carrier moves to film attaching position. The film is held down and the carrier moves to the cutting position. The cutter lowers onto the ring, rotates to cut the film and moves up. The carrier moves out in front of the placement area. The operator removes the work piece after adhesion.
Specifications
| Dimensions | 900 mm× 1100 mm × 2256 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 600 kg |
| AC power | 1 Ø 220 V ∕ 10 A |
| Air supply | 5 Kgf ∕ cm2 (10 ØTube) |
Object Wafer and Ring
| Wafer size | 2″~ 6″ |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Flat ring size | 10″ Flat Ring ( inner Ø 300 mm; outer 360 mm; ｔ＝ 1.0 ~ 1.3 mm ) |
Features
Flat Ring Placement Detection
Multiple Options for Wafer Suction
Independent Flat Ring Film Attachment Possible
Quick Replacement
Quick replacement of membrane and waste material reels
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
