Feature
- CCD of detecting full ∕ broken wafer
- Top CCD
- Floating pressing mechanism and IR ∕ B light source
- Suitable for 2-inch, 4-inch and 6-inch wafers
Patent
Top CCDPressing MechanismLightingBreaking Mode
Advantages
- Image auto-focus function
- Adjustable Large Hammer
- Auxiliary light on table
- CCD of detecting full/broken wafer
- CCD of imaging from top to bottom
- PC ∕ PLC: user-friendly touch screen; advanced image processing system
Operation
The wafer attached to Flat Ring is placed onto the table of the breaker from the cassette automatically. In the image system, the laser cutting line level is adjusted automatically, and the laser cutting traverse level is adjusted automatically. After the locations of Y-axis and cutter-axis are searched on the edge of the wafer, breaking (in X and Y directions) is performed according to the recipe of the work piece types. After breaking is complete, the operator unloads the work piece.
Specifications
| Dimensions | 1370 mm × 1260 mm × 2250 mm ( Ｗ×Ｄ×Ｈ ) |
|---|---|
| Weight | 800 kg |
| AC power | 1 Ø 220 V ∕ 4.5 A |
| Air supply | 5 Kgf ∕ cm2 ( 6 Ø Tube ) |
Object Wafer and Ring
| Wafer size | 2″~ 6″, under thickness 300 μm |
|---|---|
| Chip size | 7 mils x 7 mils ~ 60 mils x 60 mils ( max. ) |
| Flat ring size | 8″ Flat Ring ( inner Ø 250 mm; outer 296 mm; ｔ＝1.0 ~ 1.3 mm ) |
Features
CCD of Detecting Full ∕ Broken Wafer
Automatic identification of intact/broken work piece and rapid search for wafer boundary for great reduction of splitting time
Y-Axis Aligns Automatically
set each cut or any cut to align once
θ-Axis Calibration and Y-Axis Alignment
set each cut or any cut to align once
Floating Pressing Mechanism and IR/B Light Source
Step Servo Motor for Key Mechanism.
Double advantages of positioning compensation by servo motor and the stability of step motor
Patented Hold-Down Mechanism and Several Patented Breaking Modes
Wafers are held down to reduce wafer warping and improve production yield for breaking
Top CCD
Top CCD, recognition of ODR products
Vision Recognized
Non-cut detecting function, multiple non-breaking check functions
Search Edge of Wafer Automatically
Broken piece detection, search edge of wafer automatically and single X-axis alignment are provided for faster search
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
