Feature
- Breaks 12” wafer attached to 12” flat ring
- Capable of working on wafers with metal balls on surface
- Fully automatic wafer loading ∕ unloading, tape attachment, breaking and tape removal
- Top CCD provides vertical image from above; dual CCD design
Patent
Separate EquipmentJib Used for Semiconductor Element Breaking
Advantages
- Top CCD, recognition of ODR products
- Simultaneous works possible; work continuous at every station for increasing UPH
Operation
The robot takes the first wafer out of cassette and places it to the flipping mechanism → Automatic film attaching → Flip the wafer over and place it on breaking platform for automatic breaking → take the second wafer for film attaching → the break wafer moves to film release platform for film release → at the same time the second wafer moves to the breaking platform for automatic breaking → With the film released, the first wafer moves to the flipping mechanism → The wafer is flipped over back to 0 degree and stored in the cassette.
Specifications
| Dimensions | 2460 mm × 1870 mm × 2250 mm ( Ｗ×Ｄ×Ｈ ) ( including signal indicators ) |
|---|---|
| Weight | 1300 kg |
| AC power | 3 Ø ∕ 220 60 HZ Volt. (V) |
| Air supply | Air Pressure: 5 Kgf ∕ cm2
Air Tube Diameter: Ø 12 mm |
| Vacuum source | Vac. Tube Diameter Ø 8 mm |
Object Wafer and Ring
| Wafer size | 12″ |
|---|---|
| Chip size | 2 ~ 10 mm |
| Laser cut depth | None |
| Flat ring size | 12″ |
Features
High Resolution
High-resolution digital camera (effective improvement of identification) ; multiple CCDs for various sizes
Graphic Identification
Image identification is performed graphically; one image for each of sides A and B for image identification
High Precision
Step servo motor for key mechanism, high-precision linear motor
Leveling Adjustment
Starting at auto breaking mode and adjusting the level have been double checked to make sure the level is correct
Automatic Alignment
Y-axis aligns automatically (set each cut or any cut to align once)
Calibration Alignment
θ-axis calibration and Y-axis alignment (set each cut or any cut to align once)
Multiple Modes
Multiple breaking modes are provided for a wide range of products, such as edge breaking, skipped breaking and mixed breaking
Break Manually
Manual breaking and secondary breaking are provided
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
