Feature
- High-tension film lamination
- Able to handle high warpage wafers
- Wafer lamination in vacuum
Advantages
- Height control of the laminating platform: for different tensions
- Alignment: CCD graphic recognition alignment, 6″ flat edge, 8″ notch
- Wafer ID : OCR Reader
- Wafer lamination in a vacuum chamber: Vacuum lamination of wafers to a frame in a vacuum chamber (no air bubbles)
- FFU HEPA high efficiency air filtration for Class 1000 cleanroom environment
- The machine can be operated continuously without stopping. Dual-touchscreen interface
- Automatic mode for frame, wafer and tape replenishment for non-stop operation
- Fully automated operation with a robot to handle thinned wafers and increase efficiency
- Can switch to manual mode for quick processing of small amounts and broken
Operation
Step 1: Place 6″ or 8″ cassettes on the wafer stocker (which can hold up to four cassettes), install the new tape in the designated position and start operation with the unloading cassette in the unloading position (which can hold two cassettes).
Step 2: After completing the mapping scan and confirming that it is ready for operation, the following operations will be carried out at the same time:
- Take the empty frame to a high-tension laminating mechanism for tape lamination.
- Use the robot to pick up the wafer to the aligner for calibration and reading the Wafer ID.
<Simultaneous Operation>
1. Use an empty frame transfer arm from the empty frame lifting mechanism to pick up an 8″ empty frame and place it on the laminating platform, which will then move it into a high-tension laminating mechanism and start laminating the tape onto the 8″ frame as described below:
- A. Pull the new tape from the new material axle and clamp it to the tape holder.
- B. Lower the tension ring, use the height difference between the tape holder and the platform to evenly spread the tape around and adhere it to the frame, using the height difference to control the required tape lamination tension.
- C. Tension ring can be used on both 320 mm and 300 mm tape widths,
- C-1. Conversion kit required.
- C-2. For 320 mm tape width, the tension ring is pressed deeper and the tension is higher.
- D. After laminating the tape, use a cutter to cut the tape to complete the laminating process.
2. Use the robot to remove the first wafer from the cassette and place it on Alignment Mechanism to commence aligned calibration. Turn 6″ to the flat position/8″ to the notch position and read the Wafer ID.
Step 3:
- Use the robot to turn the calibrated wafer to the desired angle according to the recipe and place it on the pressing platform.
- Send the frame laminated with tape to the pressing platform and read the frame ID during transportation.
Step 4: Use a vacuum chamber, press the vacuum chamber down to the pressing platform, during which time the wafers have been fed into the pressing platform and sucked onto the platform, and the empty frame has also been fed into the pressing platform. Create the vacuum in the vacuum chamber and bond the empty tape to the wafers.
Step 5: Turn the arm over to remove the pressed and laminated frame and turn it over.
Step 6: Push the laminated wafer frame into the unloading cassette.
Keep repeating steps 2 to 6.
Specifications
| Dimensions | 2270 × 2670 × 2635 mm (Ｗ×Ｄ×Ｈ) |
|---|---|
| Weight | 2600 kg |
| AC Power | Working Voltage：240 V 50/60 Hz 1 Ø Volt. (V) Power Switch: ( NFB )：60 A |
| Air Source | Air Pressure 0.5 MPa Air Tube Diameter Ø12mm |
Object Wafer and Ring
| Wafer size | 6 & 8 inch |
|---|---|
| Chip size | None |
| Laser cut depth | None |
| Frame size | 8 inch |
| Tape size | Normal Tension: Tape Width 300-350 mm × Length 100M High Tension: Tape Width 320-350 mm × Length 100M |
Features
Tape Detection
Tape laminating / shortage detection
Tape Cutter Heating
Tape cutting: heated up to 60 degrees
High-Tension Film Lamination
Control the height of the laminating platform to apply different tape tensions
Pressing Platform Heating
Pressing platform: Carrier temperature capped at 50 degrees
Teflon
Wafer pressing platform coated with anti-static Teflon
Wafer Lamination in Vacuum
Wafer lamination under vacuum in vacuum chambers to achieve a bubble-free condition
Aligner
Precise alignment of the flat edge or notch, with the option of entering the pressing platform at any angle
Barcode
Wafer ID, Frame barcode reader
Quick Tape Change
Quick tape change and waste reel replacement
Bernoulli
For high warpage wafers
Static Elimination
Static elimination device
SEMI
SECS / GEM
*The information provided here is for reference only. The actual specifications of equipment depend on the equipment requested and delivered.
